Chiplet Design and Heterogeneous Integration Packaging

Main
Computers - Hardware
Chiplet Design and Heterogeneous...

Chiplet Design and Heterogeneous Integration Packaging

Name: Chiplet Design and Heterogeneous Integration Packaging
ISBN: 9789811999161

John H. Lau

5.0 / 5.0

0 comments

यह पुस्तक आपको कितनी अच्छी लगी?

फ़ाइल की गुणवत्ता क्या है?

पुस्तक की गुणवत्ता का मूल्यांकन करने के लिए यह पुस्तक डाउनलोड करें

डाउनलोड की गई फ़ाइलों की गुणवत्ता क्या है?

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

श्रेणियाँ:

Computers - Hardware

साल:

2023

प्रकाशन:

Springer

भाषा:

english

पृष्ठ:

541

ISBN 10:

9811999163